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DISCO Corporation (Japan) - Facts, Figures and Analytical Insights

Abstract

This report presents quick facts about DISCO Corporation, which is principally involved in providing Precision Processing Systems, Industrial Grinding Products, and Precision Processing Parts. Illustrated with 27 tables, the report showcases the company's recent news stories and events, sales performance, key markets and market position as against its competitors operating in the industry.

Code: PCP-63196
Price: $1350
Company Type: Public
Pages: 30
Date: January 2016
Market Data Tables: 27

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Table 1: DISCO Corporation’s Sales by Geographic Region Worldwide (2014) in Percentage for Asia, Japan, The Americas and Europe......3
Table 2: DISCO Corporation’s Sales by Product Segment Worldwide (2014) in Percentage for Precision Processing Equipment (Dicers and Grinders), Consumables, Maintenance Parts, Industrial Products, and Others......4
Heat Treatment Market......5
Table 3: Heat Treatment Market by Product in Japan (2014) - Percentage Share Breakdown by Value Sales for Electric Machinery, Metal Products, Ordinary Machinery, Precision Machinery and Transportation Machinery......5
Machine Tools......6
Table 4: High End Machine Tools Market by Segment in Taiwan (2014) - Percentage Share Breakdown by Value Sales for 3C, Semiconductor, Optoelectronics, Aerospace, Automobile, Energy, Precision Parts, Metal Component Processing, and Others......6
Cutting Tools......7
Table 5: Welding and Cutting Industry End Market by Region Worldwide (2014) - Percentage Share Breakdown by Value Sales for General Fabrication, Heavy Fabrication, Maintenance and Repair, Offshore, Pipe Mill, Pipelines, Power Generation/Process, Shipbuilding, Structural (Construction), and Transportation......7
Table 6: Welding and Cutting Industry Market by Region Worldwide (2014) - Percentage Share Breakdown by Value Sales for China, Commonwealth of Independent States (CIS), and Russia, Europe, India, Japan, North America, South America, and Others......8
Laser Processing Equipment......9
Table 7: Chinese Laser Processing Equipment Sales (2014) in Units......9
Table 8: Laser Market by End-Use Applications in China (2014) - Percentage Share Breakdown by Value Sales for Laser Components, Laser Measurement, Laser Medical Treatment, Laser Processing& Equipment, Optical Communication and Others......10
Semiconductor Wafers......11
Table 9: Semiconductor Wafer Market by Country Worldwide (2015) - Percentage Share Breakdown by Value for Japan, and Others......11
Semiconductor Equipment......12
Table 10: Semiconductor Back End Equipment Market by Segment Worldwide (2015) - Percentage Share Breakdown by Value for Die Bonders, Dioing, Molding, Test, Wire Bonders, and Others......12
Table 11: Semiconductor Front End Equipment Market by Segment Worldwide (2015) - Percentage Share Breakdown by Value for Die Attach, Packaging, Wire Bonding, and Others......13
Table 12: Semiconductor Production Equipment (SPE) Market by Region Worldwide (2014) - Percentage Share Breakdown by Value for Japan, Netherlands, South Korea, US, and Others......14
Blades......15
Table 13: Market Shares of Leading Blade Manufacturers in Japan (2015) - Percentage Breakdown by Value for DISCO Corporation, Mitsubishi Materials Corporation, and Others......15
Dicers......16
Table 14: Market Shares of Leading Dicer Manufacturers in Japan (2015) - Percentage Breakdown by Value for Apic Yamada Corporation, DISCO Corporation, Tokyo Seimitsu Co., Ltd., and Others......16
Semiconductor Equipment......17
Table 15: Market Shares of Leading Semiconductor Equipment Manufacturers Worldwide (2015) - Percentage Breakdown by Value for Fairchild Semiconductor International, Inc., National Semiconductor Corporation ON Semiconductor Corporation STMicroelectronics N.V., Texas Instruments Inc., Toshiba Corporation, and Others......17
Table 16: Market Shares of Leading Semiconductor Assembly Equipment Manufacturers Worldwide (2015) - Percentage Share Breakdown by Value for ASM Pacific Technology, Ltd., BE Semiconductor Industries NV, Kulicke and Soffa Industries, Inc., and Others......18
Table 17: Market Shares of Leading Semiconductor Equipment Manufacturers Worldwide (2015) - Percentage Share Breakdown by Value for Applied Materials, Inc., ASML Holding NV, Tokyo Electron Limited, Lam Research Corporation, KLA-Tencor Corporation, Dainippon Screen Mfg. Co., Ltd., Advantest Corporation, Hitachi High-Technologies Corporation, Nikon Corporation, ASM International and Others......19
Table 18: Market Shares of Leading Semiconductor Production Equipment (SPM) Manufacturers Worldwide (2014) - Percentage Breakdown by Value for Advantest Corporation, Applied Materials, Inc., ASM International NV, ASML Holding NV, Daifuku Co., Ltd., Dainippon Screen Mfg. Co., Ltd., Disco Corporation, Hitachi High-Technologies Co., Ltd., Hitachi Kokusai Electric, Inc., Kla-Tencor Corporation, Kulicke and Soffa Industries, Inc., Lam Research Corporation, Nikon Metrology NV, NuFlare Technology, Inc., Schmidt Electronics Asia, Ltd., Teradyne, Inc., Tokyo Electron, Ltd., Tokyo Seimitsu Co., Ltd., and Others* (Aixtron SE, BESI, Inc., Canon Anelva Corporation, Canon Anelva Corporation, Canon Semiconductor Equipment Taiwan, Inc., EBARA Technologies, International Business Machines Corporation, Murata Machinery, Ltd., Novellus Systems, Inc., Rudolph Technologies, Inc., Towa Corporation, Ulvac Technologies, Inc., and Veeco Instruments, Inc.)......20
Cutting Machinery......21
Table 19: Market Shares of Leading Welding and Cutting Machinery Manufacturers by Value Sales Worldwide (2014) - Percentage Breakdown for Air Liquide S.A., Airweld, Inc., Big Bridge, Bohler, ESAB, Victor Technologies International, Inc., Fronius International GmbH, Golden Bridge Welding Materials Group Co., Ltd., Hypertherm, Inc., Illinois Tool Works, Inc. (ITW), Kobe Steel, Ltd., Lincoln Electric, Panasonic Welding Systems Co., Ltd., and Others......21
Wafer-Level Packaging Equipment......22
Table 20: Market Shares of Leading Wafer-Level Packaging Equipment Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for Applied Materials, Inc., DISCO Corporation, EV Group, Rudolph Technologies, Inc., Semes Co., Ltd., SUSS MicroTec Group, The, Tokyo Electron, Ltd., Tokyo Seimitsu Co., Ltd., Ultratech, Inc., Ulvac Technologies, Inc., and Others......22
Semiconductor Etch......23
Table 21: Market Shares of Leading Compound Semiconductor Etch Companies Worldwide (2014) - Percentage Breakdown by Value for Lam Research Corporation, ULVAC Technologies, Inc., and Others......23
Dry Etch......24
Table 22: Market Shares of Leading Dielectric Etch Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for Applied Materials, Inc., Hitachi High-Technologies Corporation, Lam Research Corporation, SEMES Co., Ltd., Tokyo Electron, Ltd., and Others......24
Table 23: Market Shares of Leading Dry Etch Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for Applied Materials, Inc., Hitachi High-Technologies Corporation, Lam Research Corporation, Tokyo Electron, Ltd., and Others......25
Table 24: DISCO Corporation's Sales by Segment in Japan (2015) - Percentage Market Share Breakdown by Value for Industrial Grinding Products, Precision Processing Parts, and Precision Processing Systems......26
Table 25: DISCO Corporation's Sales by Product in Japan (2015) - Percentage Market Share Breakdown by Value for Components, Dicer, Grinder, Precision Diamond Tools, and Others......27
Table 26: DISCO Corporation's Dicer Sales by Equipment in Japan (2015) - Percentage Market Share Breakdown by Value for Integrated Circuit (IC), Non Semiconductors, Optosemiconductors, Packaged, and Others......28
Table 27: DISCO Corporation's Grinder Sales by Equipment in Japan (2015) - Percentage Market Share Breakdown by Value for Electronic Materials, Semiconductors, and Wafers......29