Welcome : Guest

Globetronics Technology Bhd. (Malaysia) - Facts, Figures and Analytical Insights

Abstract

This report presents quick facts about Globetronics Technology Bhd., which is principally involved in Assembling and Testing of Integrated Circuits, Chip Carrier Quartz Crystal Products and Optoelectronic Products. Illustrated with 47 tables, the report showcases the company's sales performance, key markets and market position as against its competitors operating in the industry.

Code: PCP-35390
Price: $2350
Company Type: Public
Pages: 49
Date: January 2017
Market Data Tables: 47

 NOTE : Select the checkbox below, and click Add to Cart button to add this report to your shopping cart.
Table 1: Globetronics Technology Bhd.'s Sales by Country Worldwide (2014-2015) in Percentage for Malaysia, Singapore, and Others......3
Assembly Equipment......4
Table 2: Global Assembly Equipment Market (2014) in US$ Million......4
Table 3: Assembly Equipment Market by Segment Worldwide (2015) - Percentage Share Breakdown by Value Sales for Die Attach, Packaging, Plating, Wire Bonding, and Others......5
Integrated Circuits (ICs)......6
Table 4: Integrated Circuit (IC) Market by Category Worldwide (2015) - Percentage Share Breakdown by Value Sales for Analog, Logic, and Memory......6
Table 5: Integrated Circuits (ICs) Production in Taiwan (2015) in NT$ 100 Million......7
Table 6: Integrated Circuits Market by Category Worldwide (2015) - Percentage Share Breakdown by Volume Sales for Flip Chip and Wafer Level Packaging and Others......8
Table 7: Integrated Circuits Market by Type Worldwide (2015) - Percentage Share Breakdown by Value Sales for Analog, DRAM, DSP, MCU, MPU, NAND Flash, NOR Flash, and Others......9
Analog Integrated Circuits (IC)......10
Table 8: Analog Memory Integrated Circuits (ICs) Market by Type Worldwide (2015) - Percentage Share Breakdown by Value Sales for Non-Volatile, Volatile, and Others......10
Table 9: General Purpose Analog Integrated Circuit Market by Segment Worldwide (2015) - Percentage Share Breakdown by Value Sales for Amplifiers, Interface, Power Management, and Signal Conversion......11
Table 10: Analog Integrated Circuit (IC) Market by Sector Worldwide (2015) - Percentage Share Breakdown by Value for Automotive, Communications, Consumer, and Industrial, Medical and Military (IMM)......12
Table 11: Analog Integrated Circuits (ICs) Market by Application Worldwide (2015) - Percentage Share Breakdown by Value for Amplifier, Analog ASSP (Non-Power IC), Analog ASSP (Power IC), Comparators, Data Conversion, Interface, and Standard Power IC......13
Table 12: Analog Integrated Circuits (ICs) Market by Segment Worldwide (2015) - Percentage Share Breakdown by Value Sales for Application Specific, and General Purpose Analog......14
Application-Specific Integrated Circuit (ASIC)......15
Table 13: Application-Specific Integrated Circuit (ASIC) Market by Country Worldwide (2015) - Percentage Share Breakdown by Value for Japan, and Others......15
Table 14: Application-Specific Integrated Circuit (ASIC) Market by End-Use Segment Worldwide (2015) - Percentage Market Share Breakdown by Value Sales for Automotive, IC Card, Wired Communication, Wireless Communication, Computer, Consumer and Others......16
Large Panel Display Driver ICs (DDI)......17
Table 15: Large Panel Display Driver ICs (DDI) Demand by Segment Worldwide (2015) - Percentage Share Breakdown by Value for TV, Monitor, Notebook, and Tablet......17
Table 16: Large Panel Display Driver ICs (DDI) Shipments Worldwide (2015-2020) in Million Units......18
Table 17: Global LCD Driver IC Market by End-Use (2012-2017) in Million Units for TV, Flat Panel Monitors, Notebooks, Tablets, Handsets, and Smartphones......19
Table 18: Display Driver IC (Integrated Circuit) Market by Category Worldwide (2015) - Percentage Share Breakdown by Volume for Monitor, Notebook, Tablet, and TV......20
Table 19: Volatile Integrated Circuit (IC) Market by Segment Worldwide (2015) - Percentage Share Breakdown by Value Sales for DRAM, and SRAM......21
Integrated Circuits (ICs) Packaging and Testing Equipment......22
Table 20: Integrated Circuits (ICs) Packaging and Testing Equipment Production in Taiwan (2015) in NT$ 100 Million......22
LCD Driver IC Test and Assembly......23
Table 21: LCD Driver IC Test and Assembly Market by Product Worldwide (2015) - Percentage Share Breakdown by Value for Chip Board, ChipMOS, LB Semicon, Nepes, and Others......23
Semiconductor Components......24
Table 22: Semiconductor Component Market for Telecom by Category in the US (2015) - Percentage Share Breakdown by Value for Driver, Modulator and Transimpedance Amplifier (TIA)......24
Table 23: High-Speed Semiconductor Component Market by Segment in the US (2015) - Percentage Share Breakdown by Value for Application-Specific Integrated Circuit (ASIC), Datacom, Driver, E-band, Modulator and Transimpedance Amplifier (TIA)......25
Table 24: Optical Semiconductor Component Market by Category in the US (2015) - Percentage Share Breakdown by Value for Datacom, Driver, Modulator and Transimpedance Amplifier (TIA)......26
Table 25: Optical Semiconductor Component Market by Product Segment in the US (2015) - Percentage Share Breakdown by Value for Datacom and Telecom......27
Semiconductors......28
Table 26: Global Semiconductors Market by Type (2015) - Percentage Share Breakdown by Value Sales for Analog, Discretes, DRAM, Logic Devices, Micro, NAND Flash, NOR Flash, Optoelectronics, and Sensors......28
Table 27: Semiconductor Devices Market by Type Worldwide (2015) - Percentage Breakdown by Value Sales for Application-Specific Integrated Circuits (ASIC), Application-Specific Standard Products (ASSP), Analog Semiconductors, Discrete Semiconductors, Display Drivers, DRAMs, Flash Memory (NAND and NOR), Image Sensors, and Others......29
Table 28: Semiconductor Market by Application Worldwide (2015) - Percentage Share Breakdown by Value for Automotive Electronics, Communication Electronics, Consumer Electronics, Data Processing Electronics, and Industrial Electronics, and Others......30
Table 29: Semiconductor Market by Product Segment Worldwide (2015) - Percentage Breakdown by Value for A&P Type, Micro Controller Unit (MCU), System-on-Chip (SOC) and Others......31
Table 30: Semiconductor Market by Region Worldwide (2015) - Percentage Share Breakdown by Value for Asia-Pacific, Europe, Japan, and United States......32
Table 31: Semiconductor Market by Segment in Germany (2015) - Percentage Share Breakdown by Value for Automotive Electronics, Consumer Electronics, Data Processing Technology, Industrial Electronics, and Telecommunications......33
Table 32: Semiconductors Market by Type Worldwide (2015) - Percentage Share Breakdown by Value Sales for Optoelectronics, Sensors, IC, and Discretes......34
Table 33: Semiconductors Market Worldwide (2015-2020) in US$ Million......35
Sensors......36
Table 34: Sensors Market by Application Worldwide (2015) - Percentage Share Breakdown by Value for Consumer, Industrial, Medical, Transportation and Others......36
Table 35: Sensors Market by Category Worldwide (2015) - Percentage Share Breakdown by Value for Memory, Semiconductor, Semiconductor Equipment, and Semiconductor Sensor......37
Table 36: Sensors Market by Category Worldwide (2015) - Percentage Share Breakdown by Value Sales for Bio and Chemical Sensors, Flow and Level Sensors, Image Sensors, Position Sensors, Pressure Sensors, Temperature/Humidity Sensors, and Others......38
Table 37: Sensors Market by Type Worldwide (2015) - Percentage Share Breakdown by Value for Nonoptical Sensors, and Optical Sensors......39
Table 38: Sensors Market by Type Worldwide (2015) - Percentage Share Breakdown by Volume for Pressure, Pressure Switches, Speed and Position, Temperature, and Others......40
Table 39: Sensors Market Worldwide (2015-2020) in US$ Million......41
Assembly......42
Table 40: Market Shares of Leading Assembly Equipment Manufacturers by Value Sales Worldwide (2015) - Percentage Breakdown for Amkor Technology, Inc., ASE Group, ChipMOS Technologies (Bermuda) Ltd., J-Devices Corporation, Jiangsu Co., Ltd., Siliconware Precision Industries Co., Ltd., STATS ChipPAC Ltd., United Test and Assembly Center Ltd., and Others......42
Analog/Linear Integrated Circuit (IC) Test Equipment......43
Table 41: Market Shares of Leading Analog/Linear Integrated Circuit (IC) Test Equipment Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for LTX-Credence Corporation, and Others......43
Crystal Components......44
Table 42: Market Shares of Leading Crystal Component Manufacturers in Japan (2015) - Percentage Breakdown by Value for Epson Electronics America Inc., KDS America (Daishinku Corporation), KYOCERA Electronic Devices LLC, Nihon Dempa Kogyo Co., Ltd., TXC Corporation, and Others......44
Table 43: Market Shares of Leading Crystal Component Manufacturers Worldwide (2015) - Percentage Breakdown by Value for Epson Electronics America Inc., Hosonic Electronic Co., Ltd., KDS America (Daishinku Corporation), KYOCERA Electronic Devices LLC, Micro Crystal, Nihon Dempa Kogyo Co., Ltd., RIVER Eletec Corporation, TXC Corporation, and Others......45
Edge QAM Modulator......46
Table 44: Market Shares of Leading Edge QAM Modulator Providers in the US (2014) - Percentage Breakdown by Value for ARRIS Group, Inc., Cisco Systems, Inc., Harmonic, Inc., and Others......46
Wafer Level Packaging......47
Table 45: Market Shares of Leading Wafer Level Packaging Providers by Value Sales Worldwide (2015) - Percentage Share Breakdown for Applied Materials, Inc., Cisco Systems, Inc., EV Group, Randolph Technology, Inc., ULVAC Technologies, Inc., and Others......47
Wafer Level Packaging Inspection......48
Table 46: Market Shares of Leading Wafer Level Packaging Inspection Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for Camtek, Ltd., KLA-Tencor Corporation, Rudolph Technologies, Inc., Topcon Technohouse Corporation, Toray Engineering Co., Ltd., and Others......48
Wafer-Level Packaging Equipment......49
Table 47: Market Shares of Leading Wafer-Level Packaging Equipment Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for Applied Materials, Inc., DISCO Corporation, EV Group, Rudolph Technologies, Inc., Semes Co., Ltd., SUSS MicroTec Group, The, Tokyo Electron, Ltd., Tokyo Seimitsu Co., Ltd., Ultratech, Inc., Ulvac Technologies, Inc., and Others......49