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SSS MicroTec AG (Germany) - Facts, Figures and Analytical Insights

Abstract

This report presents quick facts about SSS MicroTec AG, which is principally involved in supplying Lithography, Substrate Bonder, and Photomask Equipment. Illustrated with 31 tables, the report showcases the company's recent news stories and events, sales performance, key markets and market position as against its competitors operating in the industry.

Code: PCP-12887
Price: $1550
Company Type: Public
Pages: 34
Date: September 2016
Market Data Tables: 31

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Table 1: SÜSS MicroTec AG’s Sales by Product Category Worldwide (2014-2015) in Percentage for Machines, Spare Parts and Upgrades, Services, MicroOptics, and Others......3
Table 2: SÜSS MicroTec AG’s Sales by Business Segment Worldwide (2014-2015) in Percentage for Lithography, Substrate Bonder, Photomask Equipment, and Others......4
Table 3: SÜSS MicroTec AG’s Sales by Geographic Region Worldwide (2014-2015) in Percentage for Europe, The Middle East and Africa (EMEA), North America, Japan, and Rest of Asia......5
Lithography Equipment......6
Table 4: Lithography Equipment Market by Category Worldwide (2015) - Percentage Share Breakdown by Value for Alternate Exposure & White Tools, Steppers, and Others......6
Table 5: Lithography Equipment Market by Country Worldwide (2015) - Percentage Share Breakdown by Value for Japan, and Others......7
Wafer Supply......8
Table 6: Wafer Supply Market by Category Worldwide (2015) - Percentage share Breakdown by Value for Cell, Module, Wafer, and Others......8
Table 7: Wafer Demand by Application Worldwide (2015) - Percentage Market Share Breakdown by Value for Automotive, Industrial, Mobile Devices, Personal Computer (PC), Solid State Drive (SSD), and Others......9
Wafer Fabric Equipment (WFE)......10
Table 8: Wafer Fabric Equipment (WFE) Market by Category Worldwide (2015) - Percentage Share Breakdown by Value for Clean, Chemical Vapor Deposition (CVD), Dry Etching, Manufacturing Automation, Process Control, Sputtering, Wafer Lithography, and Others......10
Lithography......11
Table 9: Market Shares of Leading Lithography Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for ASML Holding NV, Canon, Inc., Nikon Metrology NV, and NuFlare Technology, Inc.......11
Advanced Packaging Lithography......12
Table 10: Market Shares of Leading Advanced Packaging Lithography Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for Canon, Inc., EV Group, Suss MicroTec, Ultratech, Inc., USHIO America, Inc., and Others......12
Contact/Proximity Lithography......13
Table 11: Market Shares of Leading Contact/Proximity Lithography Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for SUSS MicroTec Group, and Others......13
Direct-Write E-Beam Lithography......14
Table 12: Market Shares of Leading Direct-Write E-Beam Lithography Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for JEOL, Ltd., and Vistec Electron Beam Lithography Group......14
E-Beam Mask-Making Lithography......15
Table 13: Market Shares of Leading E-Beam Mask-Making Lithography Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for JEOL, Ltd., and NuFlare Technology, Inc.......15
Epitaxial Wafers......16
Table 14: Market Shares of Leading Epitaxial Wafers Manufacturers Worldwide (2015) - Percentage Breakdown by Value for EpiWorld International Co., Ltd., Hitachi Metals, Ltd., IntelliEPI, IQE Plc, Kopin Corporation, Inc., Picogiga International (Soitec), Sumitomo Electric Industries, Ltd., Visual Photonics Epitaxy Co., Ltd., and Others......16
Optical Mask-Making Lithography......17
Table 15: Market Shares of Leading Optical Mask-Making Lithography Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for Micronic Mydata AB, and Molecular Imprints, Inc.......17
Photo mask......18
Table 16: Market Shares of Leading Photo Mask Manufacturers by Value Sales Worldwide (2014) - Percentage Breakdown for Dai Nippon Printing Co., Ltd., Hoyo Industrial Co., Ltd., Photronics, Inc., Toppan Printing Co., Ltd., Captive Suppliers, and Others......18
Table 17: Market Shares of Leading Photomask Manufacturers in Japan (2015) - Percentage Share Breakdown by Value for DNP Photomask Technology Taiwan Co., Ltd., Hoya Corporation, Photronics, Inc., Toppan Printing Co., Ltd., and Others......19
Wafers......20
Table 18: Market Shares of Leading Wafer Manufacturers Worldwide (2015) - Percentage Share Breakdown by Value for GCL-Poly Energy Holdings, Ltd., Green Energy Technology, JA Solar Holdings, JinkoSolar Holding Co., Ltd., LDK Solar Co., Ltd., ReneSola, Ltd., Solarworld, Trina Solar, Ltd., Yingli Green Energy Holding Company, Ltd., and Others......20
Table 19: Market Shares of Leading Wafer Manufacturers by Value Sales in Thailand (2015) - Percentage Share Breakdown for Universal Robina Corporation, and Others......21
Silicon Wafers......22
Table 20: Market Shares of Leading Silicon Wafer Manufacturers Worldwide (2015) - Percentage Share Breakdown by Value for LG Siltron Inc., Shin-Etsu Chemical Co., Ltd., Siltronic AG, Sino-American Silicon Products Inc., SUMCO Corporation, SunEdison, Inc., and Others......22
Wafer Bonders......23
Table 21: Market Shares of Leading Wafer Bonders (Through Silicon Via) Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for EV Group, and Suss MicroTec......23
Wafer Fabrication Equipment......24
Table 22: Market Shares of Leading Wafer Fabrication Equipment Manufacturers Worldwide (2015) - Percentage Share Breakdown by Value for Applied Materials, Inc., ASML Holding N.V., Dainippon Screen Mfg. Co., Ltd., KLA- Tencor Corporation, Lam Research Corporation, Tokyo Electron Ltd., and Others......24
Wafer Inspection Systems......25
Table 23: Market Shares of Leading Wafer Inspection Systems Providers by Value Sales Worldwide (2014) - Percentage Breakdown for Applied Materials, Inc., KLA-Tencor Corporation, and Others......25
Wafer Level Packaging......26
Table 24: Market Shares of Leading Wafer Level Packaging Inspection Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for Camtek, Ltd., KLA-Tencor Corporation, Rudolph Technologies, Inc., Topcon Technohouse Corporation, Toray Engineering Co., Ltd., and Others......26
Table 25: Market Shares of Leading Wafer Level Packaging Providers by Value Sales Worldwide (2015) - Percentage Share Breakdown for Applied Materials, Inc., Cisco Systems, Inc., EV Group, Randolph Technology, Inc., ULVAC Technologies, Inc., and Others......27
Table 26: Market Shares of Leading Wafer-Level Packaging Equipment Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for Applied Materials, Inc., DISCO Corporation, EV Group, Rudolph Technologies, Inc., Semes Co., Ltd., SUSS MicroTec Group, The, Tokyo Electron, Ltd., Tokyo Seimitsu Co., Ltd., Ultratech, Inc., Ulvac Technologies, Inc., and Others......28
Table 27: Market Shares of Leading Wet Clean for Wafer-Level Packaging Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for EV Group, Suss MicroTec, and Others......29
Table 28: SUSS MicroTec’s Sales by End Use Segment Worldwide (2015) - Percentage Breakdown by Value Sales for LEDs, MEMS, and Semiconductors......30
Table 29: Suess MicroTec AG’s Sales by Geographic Region Worldwide (2013-2014) in Percentage for EMEA (Europe, The Middle East and Africa), North America, Japan and Rest of Asia......31
Table 30: Suess MicroTec AG’s Sales by Business Segment Worldwide (2013-2014) in Percentage for Lithography, Substrate Bonder, Photomask Equipment and Others......32
Table 31: Suess MicroTec AG’s Sales by Product Category Worldwide (2013-2014) in Percentage for Machines, Spare Parts and Upgrades, Services and Others......33