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Unisem (M) Bhd. (Malaysia) - Facts, Figures and Analytical Insights

Abstract

This report presents quick facts about Unisem (M) Bhd., which is principally involved in Semiconductor Devices Business. Illustrated with 16 tables, the report showcases the company's sales performance, key markets and market position as against its competitors operating in the industry.

Code: PCP-12459
Price: $800
Company Type: Public
Pages: 17
Date: September 2016
Market Data Tables: 16

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Table 1: Unisem, M Bhd.'s Sales by Geographic Region Worldwide (2014-2015) in Percentage for Asia, Europe, and USA......2
Table 2: Unisem, M Bhd.’s Sales by Geographic Region Worldwide (2014) in Percentage for Asia and Others......3
Semiconductor Devices......4
Table 3: Semiconductor Devices Market by Type Worldwide (2015) - Percentage Breakdown by Value Sales for Application-Specific Integrated Circuits (ASIC), Application-Specific Standard Products (ASSP), Analog Semiconductors, Discrete Semiconductors, Display Drivers, DRAMs, Flash Memory (NAND and NOR), Image Sensors, and Others......4
Outsourced Semiconductor Assembly and Test (OSAT)......5
Table 4: Global Outsourced Semiconductor Assembly and Test Market (OSAT) (2012-2017) in US$ Million......5
Table 5: Outsourced Semiconductor Assembly and Test Market (OSAT) Worldwide by Company (2014): Percentage Share Breakdown by Value Sales for Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., Siliconware Precision Industries Co., Ltd., STATS ChipPac Ltd., ChipMOS TECHNOLOGIES (Bermuda) Ltd., and Others......6
Flip Chips......7
Table 6: Global Flip Chip Market (2012-2017) in US$ Million......7
Table 7: Global Flip Chip Market by Application (2012-2017) in Million Units for Aerospace and Defense, Automotive, Industrial and Medical, Consumer, Computing, and Telecommunications......8
Table 8: Flipchips Market by Category Worldwide (2015) - Percentage Share Breakdown by Value Sales for 14nm and Below, 20/22nm, 28/32nm, 40/45nm, 65nm and 90nm and Above......9
Flip Chip (FC) Packaging......10
Table 9: Flip Chip (FC) Packaging Market by Country Worldwide (2015) - Percentage Share Breakdown by Value for Japan, and Others......10
Discrete Semiconductor Devices......11
Table 10: Market Shares of Leading Discrete Semiconductor Device Manufacturers by Value Sales Worldwide (2015) - Percentage Breakdown by Value Sales for Fairchild Semiconductor International, Inc., Fuji Electric Co., Ltd., Infineon Technologies AG, International Rectifier Corporation, Mitsubishi Group, NXP Semiconductors, ON Semiconductor, Renesas Electronics Corporation, ROHM Co., Ltd., STMicroelectronics N.V., Toshiba Corporation, and Vishay Intertechnology, Inc., and Others......11
Outsourced Semiconductor Assembly and Test (OSAT)......12
Table 11: Market Shares of Leading OSAT Service Providers by Value Sales Worldwide (2014) - Percentage Breakdown for Amkor Technology, Inc., ChipMOS TECHNOLOGIES (Bermuda) Ltd., J-Devices Corporation, Powertech, Siliconware Precision Industries Ltd., STATS ChipPAC Ltd., UTAC Group, and Others......12
Wafer Level Packaging......13
Table 12: Market Shares of Leading Wafer Level Packaging Providers by Value Sales Worldwide (2015) - Percentage Share Breakdown for Applied Materials, Inc., Cisco Systems, Inc., EV Group, Randolph Technology, Inc., ULVAC Technologies, Inc., and Others......13
Table 13: Market Shares of Leading Wafer Level Packaging Inspection Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for Camtek, Ltd., KLA-Tencor Corporation, Rudolph Technologies, Inc., Topcon Technohouse Corporation, Toray Engineering Co., Ltd., and Others......14
Wafer-Level Packaging Equipment......15
Table 14: Market Shares of Leading Wafer-Level Packaging Equipment Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for Applied Materials, Inc., DISCO Corporation, EV Group, Rudolph Technologies, Inc., Semes Co., Ltd., SUSS MicroTec Group, The, Tokyo Electron, Ltd., Tokyo Seimitsu Co., Ltd., Ultratech, Inc., Ulvac Technologies, Inc., and Others......15
Table 15: Unisem (M) Berhad's Revenue by Service Segments Worldwide (2015) - Percentage Breakdown by Value Sales for Packaging, Testing, and Wafer Bumping......16
Table 16: Unisem (M) Berhad's Sales by End-Use Segments Worldwide (2015) - Percentage Breakdown by Value Sales for Automotive, Communications, Computers, Consumer Electronics, and Industrial......17