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Axcelis Technologies, Inc. (USA) - Facts, Figures and Analytical Insights

Abstract

This report presents quick facts about Axcelis Technologies, Inc., which is principally involved in Ion Implantation and Other Processing Equipment Business. Illustrated with 26 tables, the report showcases the company's recent news stories and events, sales performance, key markets and market position as against its competitors operating in the industry.

Code: PCP-06093
Price: $1300
Company Type: Public
Pages: 30
Date: October 2016
Market Data Tables: 26

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Table 1: Axcelis Technologies, Inc.’s Sales by Product Category Worldwide (2014-2015) in Percentage for Ion Implantation Systems, Services, and Royalties, and Other Systems and Services......3
Table 2: Axcelis Technologies, Inc.’s Sales by Geographic Region Worldwide (2014-2015) in Percentage for United States, Europe, and Asia-Pacific......4
Semiconductor Capital Equipment......6
Table 3: Semiconductor Capital Equipment Market by Type Worldwide (2015) - Percentage Share Breakdown by Value for Chemical Vapor Deposition, Conductor Etch, Dry Etch (incl. TSV Pump and Mask Etching), Non Tube Reactor Chemical Vapor Deposition, Wafer Fabrication Equipment, and Others......6
Semiconductor Equipment......7
Table 4: Semiconductor Equipment Market by Category Worldwide (2015) – Percentage Share Breakdown by Value for Assembly Equipment, Testing Equipment, and Wafer Fabrication Equipment......7
Table 5: Semiconductor Front End Equipment Market by Segment Worldwide (2015) - Percentage Share Breakdown by Value for Die Attach, Packaging, Wire Bonding, and Others......8
Table 6: Semiconductor Production Equipment (SPE) Market by Region Worldwide (2015) - Percentage Share Breakdown by Value for Japan, Netherlands, South Korea, US, and Others......9
Table 7: Semiconductor Equipment Production in Taiwan (2015) in NT$ Million......10
Wafer Fabric Equipment (WFE)......11
Table 8: Wafer Fabric Equipment (WFE) Market by Category Worldwide (2015) - Percentage Share Breakdown by Value for Clean, Chemical Vapor Deposition (CVD), Dry Etching, Manufacturing Automation, Process Control, Sputtering, Wafer Lithography, and Others......11
Semiconductor Capital Equipment......12
Table 9: Market Shares of Leading Semiconductor Capital Equipment Companies by Value Sales Worldwide (2014) - Percentage Breakdown for Applied Materials, ASM International, ASML, Dainippon Screen, KLA-Tencor, Lam Research, Nikon, Novellus Systems, Teradyne, Tokyo Electron and Others......12
Dry Strip......13
Table 10: Market Shares of Leading Dry Strip (TSV (Through-Silicon Via) and Bump) Companies Worldwide (2014) - Percentage Breakdown by Value for Axcelis Technologies, Inc., Hitachi High-Technologies Corporation, Hitachi Kokusai Electric, Inc., Lam Research Corporation, Mattson Technology, Inc., Novellus Systems, Inc., PSK, Inc., ULVAC Technologies, Inc., and Others......13
High-Current Implanter......14
Table 11: Market Shares of Leading High-Current Implanter Companies Worldwide (2014) - Percentage Breakdown by Value Sales for Applied Materials, Inc., Axcelis Technologies, Inc., and Sumitomo Eaton Nova......14
High-Energy Implanter......15
Table 12: Market Shares of Leading High-Energy Implanter Companies Worldwide (2014) - Percentage Breakdown by Value Sales for Applied Materials, Inc., Axcelis Technologies, Inc., and Sumitomo Eaton Nova......15
Ion Implanter......16
Table 13: Market Shares of Leading Ion Implanter Companies Worldwide (2014) - Percentage Breakdown by Value Sales for Applied Materials, Inc., Axcelis Technologies, Inc., Nissin Ion Equipment Co., Ltd., and Sumitomo Eaton Nova......16
Medium-Current Implanter......17
Table 14: Market Shares of Leading Medium-Current Implanter Companies Worldwide (2014) - Percentage Breakdown by Value for Applied Materials, Inc., Axcelis Technologies, Inc., Nissin Ion Equipment Co., Ltd., SEN Corporation, and Ulvac Technologies, Inc.......17
Table 15: Market Shares of Leading Medium-Current Implanter Companies Worldwide (2014) - Percentage Breakdown by Value Sales for Applied Materials, Inc., Nissin Ion Equipment Co., Ltd., Sumitomo Eaton Nova, and Ulvac Technologies, Inc.......18
Rapid Thermal Processing (RTP)......19
Table 16: Market Shares of Leading Rapid Thermal Processing (RTP) Companies Worldwide (2014) - Percentage Breakdown by Value Sales for Applied Materials, Inc., Dainippon Screen Mfg. Co., Ltd., Hitachi High-Technologies Corporation, Mattson Technology, Inc., Ultratech, Inc., and Others......19
Semiconductor Equipment......20
Table 17: Market Shares of Leading Semiconductor Equipment Manufacturers Worldwide (2015) - Percentage Share Breakdown by Shipments for Applied Materials, Inc., ASML Holding N.V., KLA-Tencor Corporation, Lam Research Corporation, Screen Holdings Co., Inc., Tokyo Electron Ltd., and Others......20
Table 18: Market Shares of Leading Semiconductor Equipment Manufacturers Worldwide (2015) - Percentage Share Breakdown by Value for Applied Materials, Inc., ASML Holding NV, Tokyo Electron Limited, Lam Research Corporation, KLA-Tencor Corporation, Dainippon Screen Mfg. Co., Ltd., Advantest Corporation, Hitachi High-Technologies Corporation, Nikon Corporation, ASM International and Others......21
Table 19: Market Shares of Leading Semiconductor Production Equipment (SPM) Manufacturers Worldwide (2014) - Percentage Breakdown by Value for Advantest Corporation, Applied Materials, Inc., ASM International NV, ASML Holding NV, Daifuku Co., Ltd., Dainippon Screen Mfg. Co., Ltd., Disco Corporation, Hitachi High-Technologies Co., Ltd., Hitachi Kokusai Electric, Inc., Kla-Tencor Corporation, Kulicke and Soffa Industries, Inc., Lam Research Corporation, Nikon Metrology NV, NuFlare Technology, Inc., Schmidt Electronics Asia, Ltd., Teradyne, Inc., Tokyo Electron, Ltd., Tokyo Seimitsu Co., Ltd., and Others* (Aixtron SE, BESI, Inc., Canon Anelva Corporation, Canon Anelva Corporation, Canon Semiconductor Equipment Taiwan, Inc., EBARA Technologies, International Business Machines Corporation, Murata Machinery, Ltd., Novellus Systems, Inc., Rudolph Technologies, Inc., Towa Corporation, Ulvac Technologies, Inc., and Veeco Instruments, Inc.)......22
Silicon Wafer......23
Table 20: Market Shares of Leading Silicon Wafer Manufacturers Worldwide (2015) - Percentage Share Breakdown by Value for LG Siltron Inc., Shin-Etsu Chemical Co., Ltd., Siltronic AG, Sino-American Silicon Products Inc., SUMCO Corporation, SunEdison, Inc., and Others......23
Table 21: Market Shares of Leading Wafer Bonders (Through Silicon Via) Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for EV Group, and Suss MicroTec......24
Wafer Fabrication Equipment......25
Table 22: Market Shares of Leading Wafer Fabrication Equipment Manufacturers Worldwide (2015) - Percentage Share Breakdown by Value for Applied Materials, Inc., ASML Holding N.V., Dainippon Screen Mfg. Co., Ltd., KLA- Tencor Corporation, Lam Research Corporation, Tokyo Electron Ltd., and Others......25
Table 23: Axcelis Technologies, Inc.’s Sales by Geographic Region Worldwide (2013-2014) in Percentage for United States, Europe, and Asia-Pacific......26
Table 24: Axcelis Technologies, Inc.’s Sales by Product Segment Worldwide (2013-2014) in Percentage for Ion Implantation Systems, and Other Systems......27
Table 25: Axcelis Technologies, Inc.’s Sales by Business Segment Worldwide (2013) in Percentage for Ion Implantation Systems, Services and Royalties and Other Systems and Services......28
Table 26: Axcelis Technologies, Inc.’s Revenue by Category Worldwide (2011-2013) in US$ Thousands for Product and Services......29