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Tokyo Seimitsu Co., Ltd. (Japan) - Facts, Figures and Analytical Insights

Abstract

This report presents quick facts about Tokyo Seimitsu Co., Ltd., which is principally involved in the Manufacture of Semiconductor Production Equipment (SPE), and Metrology Instruments . Illustrated with 22 tables, the report showcases the company's sales performance, key markets and market position as against its competitors operating in the industry.

Code: PCP-03201
Price: $1100
Company Type: Public
Pages: 26
Date: January 2017
Market Data Tables: 22

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  TOKYO SEIMITSU CO., LTD. (JAPAN) (Complete Report)Pages : 26|$ 1100.00
1. COMPANY SNIPPETS......1
2. MAJOR PRODUCTS AND SERVICES......2
3. SALES DATA......5
Table 1: Tokyo Seimitsu Co., Ltd.'s Sales by Business Segment (2015-2016) in Percentage for Semiconductor Production Equipment (SPE) Business, and Metrology Equipment Business......5
Table 2: Tokyo Seimitsu Co., Ltd.’s Sales by Business Segment (2014-2015) in Percentage for Semiconductor Production Equipment (SPE) and Metrology Equipment......6
4. MARKET OVERVIEW......7
Etch, Clean and Planarization Equipment......7
Table 3: Etch, Clean and Planarization Equipment Market by Country Worldwide (2015) - Percentage Share Breakdown by Value for Japan, and Others......7
Semiconductor Back End Equipment......8
Table 4: Semiconductor Back End Equipment Market by Segment Worldwide (2015) - Percentage Share Breakdown by Value for Die Bonders, Dioing, Molding, Test, Wire Bonders, and Others......8
Semiconductor Capital Equipment......9
Table 5: Semiconductor Capital Equipment Market by Type Worldwide (2015) - Percentage Share Breakdown by Value for Chemical Vapor Deposition, Conductor Etch, Dry Etch (incl. TSV Pump and Mask Etching), Non Tube Reactor Chemical Vapor Deposition, Wafer Fabrication Equipment, and Others......9
Semiconductor Equipment......10
Table 6: Semiconductor Equipment Market by Category Worldwide (2015) - Percentage Share Breakdown by Value for Assembly Equipment, Testing Equipment, and Wafer Fabrication Equipment......10
Table 7: Semiconductor Equipment Production in Taiwan (2015) in NT$ Million......11
Semiconductor Front End Equipment......12
Table 8: Semiconductor Front End Equipment Market by Segment Worldwide (2015) - Percentage Share Breakdown by Value for Die Attach, Packaging, Wire Bonding, and Others......12
Semiconductor Production Equipment (SPM)......13
Table 9: Semiconductor Production Equipment (SPE) Market by Region Worldwide (2015) - Percentage Share Breakdown by Value for Japan, Netherlands, South Korea, US, and Others......13
5. COMPETITIVE LANDSCAPE......14
Chemical Mechanical Planarization (CMP) Equipment......14
Table 10: Market Shares of Leading Chemical Mechanical Planarization (CMP) Equipment Manufacturers by Value Sales Worldwide (2014) - Percentage Breakdown for Applied Materials, Inc., Ebara Corporation, Kctech Co., Ltd., and Tokyo Seimitsu Co., Ltd.......14
Contact Probes......15
Table 11: Market Shares of Leading Contact Probes Manufacturers Worldwide (2015) - Percentage Share Breakdown by Value for SEMES Co., Ltd., Tokyo Electron Ltd., Tokyo Seimitsu Co., Ltd., and Others......15
Dicer......16
Table 12: Market Shares of Leading Dicer Manufacturers in Japan (2015) - Percentage Breakdown by Value for Apic Yamada Corporation, DISCO Corporation, Tokyo Seimitsu Co., Ltd., and Others......16
Mask Metrology......17
Table 13: Market Shares of Leading Mask Metrology Companies Worldwide (2014) - Percentage Breakdown by Value Sales for Advantest Corporation, Carl Zeiss MicroImaging GmbH, and KLA-Tencor Corporation......17
Optical Metrology......18
Table 14: Market Shares of Leading Optical Metrology Companies Worldwide (2014) - Percentage Breakdown by Value Sales for Dainippon Screen Mfg. Co., Ltd., KLA-Tencor Corporation, Nanometrics, Inc., Nova Measuring Instrument, Ltd., Rudolph Technologies, Inc., and Others......18
Wet Clean for Wafer-Level Packaging......19
Table 15: Market Shares of Leading Wet Clean for Wafer-Level Packaging Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for EV Group, Suss MicroTec, and Others......19
Semiconductor Assembly Equipment......20
Table 16: Market Shares of Leading Semiconductor Assembly Equipment Manufacturers Worldwide (2015) - Percentage Share Breakdown by Value for ASM Pacific Technology, Ltd., BE Semiconductor Industries NV, Kulicke and Soffa Industries, Inc., and Others......20
Semiconductor Equipment......21
Table 17: Market Shares of Leading Semiconductor Equipment Manufacturers Worldwide (2015) - Percentage Share Breakdown by Shipments for Applied Materials, Inc., ASML Holding N.V., KLA-Tencor Corporation, Lam Research Corporation, Screen Holdings Co., Inc., Tokyo Electron Ltd., and Others......21
Table 18: Market Shares of Leading Semiconductor Equipment Manufacturers Worldwide (2015) - Percentage Share Breakdown by Value for Applied Materials, Inc., ASML Holding NV, Tokyo Electron Limited, Lam Research Corporation, KLA-Tencor Corporation, Dainippon Screen Mfg. Co., Ltd., Advantest Corporation, Hitachi High-Technologies Corporation, Nikon Corporation, ASM International and Others......22
Semiconductor Production Equipment (SPM)......23
Table 19: Market Shares of Leading Semiconductor Production Equipment (SPM) Manufacturers Worldwide (2014) - Percentage Breakdown by Value for Advantest Corporation, Applied Materials, Inc., ASM International NV, ASML Holding NV, Daifuku Co., Ltd., Dainippon Screen Mfg. Co., Ltd., Disco Corporation, Hitachi High-Technologies Co., Ltd., Hitachi Kokusai Electric, Inc., Kla-Tencor Corporation, Kulicke and Soffa Industries, Inc., Lam Research Corporation, Nikon Metrology NV, NuFlare Technology, Inc., Schmidt Electronics Asia, Ltd., Teradyne, Inc., Tokyo Electron, Ltd., Tokyo Seimitsu Co., Ltd., and Others* (Aixtron SE, BESI, Inc., Canon Anelva Corporation, Canon Anelva Corporation, Canon Semiconductor Equipment Taiwan, Inc., EBARA Technologies, International Business Machines Corporation, Murata Machinery, Ltd., Novellus Systems, Inc., Rudolph Technologies, Inc., Towa Corporation, Ulvac Technologies, Inc., and Veeco Instruments, Inc.)......23
Wafer-Level Packaging Equipment......24
Table 20: Market Shares of Leading Wafer-Level Packaging Equipment Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for Applied Materials, Inc., DISCO Corporation, EV Group, Rudolph Technologies, Inc., Semes Co., Ltd., SUSS MicroTec Group, The, Tokyo Electron, Ltd., Tokyo Seimitsu Co., Ltd., Ultratech, Inc., Ulvac Technologies, Inc., and Others......24
6. COMPANY FACTS......25
Table 21: Tokyo Seimitsu Co., Ltd.’s Sales by Geographic Region Worldwide (2013-2014) in Percentage for Japan, East Asia, South East Asia and Other Areas......25
Table 22: Tokyo Seimitsu Co., Ltd.’s Sales by Product Segment Worldwide (2013-2014) in Percentage for Semiconductor Production Equipment (SPE) and Metrology Equipment......26