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United Microelectronics Corporation (Taiwan) - Facts, Figures and Analytical Insights

Abstract

This report presents quick facts about United Microelectronics Corporation, which is principally involved in Semiconductor Manufacturing Process Technologies. Illustrated with 30 tables, the report showcases the company's recent news stories and events, sales performance, key markets and market position as against its competitors operating in the industry.

Code: PCP-00826
Price: $1500
Company Type: Public
Pages: 34
Date: October 2016
Market Data Tables: 30

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Table 1: United Microelectronics Corporation's (Wafer Fabrication) Sales by Customer Worldwide (2014-2015) in Percentage for Fabless Design Companies, and Integrated Device Manufacturers......3
Table 2: United Microelectronics Corporation's Sales by Business Segment Worldwide (2014-2015) in Percentage for Wafer Fabrication, and New Business......4
Table 3: United Microelectronics Corporation's Sales by Geographic Region Worldwide (2014-2015) in Percentage for Taiwan, Singapore, China (Includes Hong Kong), Japan, USA, Europe, and Others......5
Assembly Equipment......7
Table 4: Global Assembly Equipment Market (2014) in US$ Million......7
Table 5: Assembly Equipment Market by Segment Worldwide (2015) - Percentage Share Breakdown by Value Sales for Die Attach, Packaging, Plating, Wire Bonding, and Others......8
Flex Circuit Assembly......9
Table 6: Flex Circuit Assembly Market by Segment Worldwide (2015) - Percentage Share Breakdown by Value Sales for Automobile, Communications, Computing Business, Consumer, Defence Electronics, Displays, IC packing, Industrial and Medical......9
Semiconductor Assembly and Test......10
Table 7: Global Outsourced Semiconductor Assembly and Test Market (OSAT) (2012-2017) in US$ Million......10
Semiconductor Front End Equipment......11
Table 8: Semiconductor Front End Equipment Market by Segment Worldwide (2015) - Percentage Share Breakdown by Value for Die Attach, Packaging, Wire Bonding, and Others......11
Semiconductor Back End Equipment......12
Table 9: Semiconductor Back End Equipment Market by Segment Worldwide (2015) - Percentage Share Breakdown by Value for Die Bonders, Dioing, Molding, Test, Wire Bonders, and Others......12
Semiconductor Capital Equipment......13
Table 10: Semiconductor Capital Equipment Market by Type Worldwide (2015) - Percentage Share Breakdown by Value for Chemical Vapor Deposition, Conductor Etch, Dry Etch (incl. TSV Pump and Mask Etching), Non Tube Reactor Chemical Vapor Deposition, Wafer Fabrication Equipment, and Others......13
Semiconductor Equipment......14
Table 11: Semiconductor Equipment Market by Category Worldwide (2015) - Percentage Share Breakdown by Value for Assembly Equipment, Testing Equipment, and Wafer Fabrication Equipment......14
Table 12: Semiconductor Equipment Production in Taiwan (2015) in NT$ Million......15
Semiconductor Production Equipment (SPM)......16
Table 13: Semiconductor Production Equipment (SPE) Market by Region Worldwide (2015) - Percentage Share Breakdown by Value for Japan, Netherlands, South Korea, US, and Others......16
Wafer Fabric Equipment (WFE)......17
Table 14: Wafer Fabric Equipment (WFE) Market by Category Worldwide (2015) - Percentage Share Breakdown by Value for Clean, Chemical Vapor Deposition (CVD), Dry Etching, Manufacturing Automation, Process Control, Sputtering, Wafer Lithography, and Others......17
Access Point Fabricators......18
Table 15: Market Shares of Leading Access Point Fabricators Worldwide (2014) - Percentage Share Breakdown by Value for Intel Corporation, Samsung, Taiwan Semiconductor Manufacturing Company, Ltd., and United Microelectronics Corporation......18
Assembly......19
Table 16: Market Shares of Leading Semiconductor Assembly Equipment Manufacturers Worldwide (2015) - Percentage Share Breakdown by Value for ASM Pacific Technology, Ltd., BE Semiconductor Industries NV, Kulicke and Soffa Industries, Inc., and Others......19
Table 17: Market Shares of Leading Assembly Equipment Manufacturers by Value Sales Worldwide (2015) - Percentage Breakdown for Amkor Technology, Inc., ASE Group, ChipMOS Technologies (Bermuda) Ltd., J-Devices Corporation, Jiangsu Co., Ltd., Siliconware Precision Industries Co., Ltd., STATS ChipPAC Ltd., United Test and Assembly Center Ltd., and Others......20
Semiconductor Assembly and Test......21
Table 18: Outsourced Semiconductor Assembly and Test Market (OSAT) Worldwide by Company (2014): Percentage Share Breakdown by Value Sales for Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., Siliconware Precision Industries Co., Ltd., STATS ChipPac Ltd., ChipMOS TECHNOLOGIES (Bermuda) Ltd., and Others......21
Foundrys......22
Table 19: Market Shares of Leading Foundry Companies Worldwide (2015) - Percentage Share Breakdown by Value Sales for GlobalFoundries, Inc., Semiconductor Manufacturing International Corporation, Taiwan Semiconductor Manufacturing Co., Ltd., United Microelectronics Corporation and Others......22
Table 20: Market Shares of Leading Dedicated Foundry Companies Worldwide (2015) - Percentage Share Breakdown by Value Sales for Globalfoundries, Inc., Semiconductor Manufacturing International Corporation, Taiwan Semiconductor Manufacturing Company, Ltd., United Microelectronics Corporation, Vanguard Group, The, and Others......23
Table 21: Market Shares of Leading Semiconductor Foundries Worldwide (2014) - Percentage Breakdown by Value for Globalfoundries, Inc., Samsung Group, Semiconductor Manufacturing International Corporation, Taiwan Semiconductor Manufacturing Company Limited (TSMC), United Microelectronics Corporation and Others......24
IC Foundries......25
Table 22: Market Shares of Leading IC Foundries Manufacturers by Value Sales Worldwide (2015) - Percentage Breakdown for Global Foundries, Inc., Huahong Grace Semiconductor Manufacturing Corporation, Samsung Group, Semiconductor Manufacturing International Corporation (SMIC), Taiwan Semiconductor Manufacturing Company, Limited (TSMC), United Microelectronics Corporation (UMC), and Others......25
Table 23: Market Shares of Leading Integrated Circuits (ICs) Foundries Worldwide (2014) - Percentage Breakdown by Value for Global Foundries, Inc., Huahong Grace Semiconductor Manufacturing Corporation, Semiconductor Equipment Corporation, Semiconductor Manufacturing International Corporation, Taiwan Semiconductor Manufacturing Company Limited (TSMC), United Microelectronics Corporation and Others......26
Semiconductor Equipment......27
Table 24: Market Shares of Leading Semiconductor Equipment Manufacturers Worldwide (2015) - Percentage Share Breakdown by Shipments for Applied Materials, Inc., ASML Holding N.V., KLA-Tencor Corporation, Lam Research Corporation, Screen Holdings Co., Inc., Tokyo Electron Ltd., and Others......27
Table 25: Market Shares of Leading Semiconductor Equipment Manufacturers Worldwide (2015) - Percentage Share Breakdown by Value for Applied Materials, Inc., ASML Holding NV, Tokyo Electron Limited, Lam Research Corporation, KLA-Tencor Corporation, Dainippon Screen Mfg. Co., Ltd., Advantest Corporation, Hitachi High-Technologies Corporation, Nikon Corporation, ASM International and Others......28
Table 26: Market Shares of Leading Semiconductor Production Equipment (SPM) Manufacturers Worldwide (2014) - Percentage Breakdown by Value for Advantest Corporation, Applied Materials, Inc., ASM International NV, ASML Holding NV, Daifuku Co., Ltd., Dainippon Screen Mfg. Co., Ltd., Disco Corporation, Hitachi High-Technologies Co., Ltd., Hitachi Kokusai Electric, Inc., Kla-Tencor Corporation, Kulicke and Soffa Industries, Inc., Lam Research Corporation, Nikon Metrology NV, NuFlare Technology, Inc., Schmidt Electronics Asia, Ltd., Teradyne, Inc., Tokyo Electron, Ltd., Tokyo Seimitsu Co., Ltd., and Others* (Aixtron SE, BESI, Inc., Canon Anelva Corporation, Canon Anelva Corporation, Canon Semiconductor Equipment Taiwan, Inc., EBARA Technologies, International Business Machines Corporation, Murata Machinery, Ltd., Novellus Systems, Inc., Rudolph Technologies, Inc., Towa Corporation, Ulvac Technologies, Inc., and Veeco Instruments, Inc.)......29
Wafer Fabrication Equipment......30
Table 27: Market Shares of Leading Wafer Fabrication Equipment Manufacturers Worldwide (2015) - Percentage Share Breakdown by Value for Applied Materials, Inc., ASML Holding N.V., Dainippon Screen Mfg. Co., Ltd., KLA- Tencor Corporation, Lam Research Corporation, Tokyo Electron Ltd., and Others......30
Table 28: United Microelectronics Corporation’s Sales by Geographic Region Worldwide (2013-2014) in Percentage for Taiwan, Singapore, China (Includes Hong Kong), Japan, USA, Europe, and Others......31
Table 29: United Microelectronics Corporation’s Sales by Business Segment Worldwide (2013-2014) in Percentage for Wafer Fabrication, and New Business......32
Table 30: United Microelectronics Corporation’s Sales by Product Segment Worldwide (2012-2013) in NT$ Thousands for Wafer Fabrication, and New Business......33