"Flip-chip is one of the key packaging techniques for microelectronic circuits. The technique is finding rapid adoption in consumer and high-end applications. The adoption of flip-chip technique is primarily fueled by its benefits in terms of performance, size, reliability, flexibility and cost in comparison to other packaging methods."
The report analyzes and presents an overview of Flip-Chip market worldwide. Supported with 2 market data tables, the report provides a review of market trends, applications, advantages of Flip-Chip technique, and further highlights on various strategic industry activities of major companies witnessed by the industry over the last few years. In addition, 28 companies operating in the Flip-Clip arena worldwide including Amkor Technology Inc., FlipChip International LLC, Kyocera America Inc., NTK Technologies Inc., Philips Lumileds Lighting Company, Signetics Corporation, STATS ChipPAC Ltd., STMicroelectronics NV, Tessera Technologies Inc., Toshiba Electronics Europe GmbH, and other are profiled.