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MCP-1236: SURFACE MOUNT TECHNOLOGY (SMT) EQUIPMENT – A GLOBAL STRATEGIC BUSINESS REPORT

February 14, 2017 – Quest for Speed & Flexibility in Electronics Manufacturing Drive Demand for Surface Mount Technology (SMT) Equipment, According to a New Report by Global Industry Analysts, Inc.

GIA launches comprehensive analysis of industry segments, trends, growth drivers, market share, size and demand forecasts on the global Surface Mount Technology (SMT) Equipment market. The global market for SMT Equipment is projected to reach US$3.9 billion by 2022, driven by technological innovations in next generation electronics, continued craze and rising demand for mobile communications devices, need for speed & flexibility in electronics manufacturing, and rise in number of electronic contract manufacturers.

Surface mount technology (SMT) represents a method by which an electronic circuit is produced. The technology involves direct placement of electronic circuit components on the surface of printed circuit boards (PCBs). All electronics hardware mass-manufactured today are produced using surface mount technology. Between 2017 and 2022, global SMT market is projected to witness rapid growth driven by increased utilization of flexible materials in PCBs, growing electronics industry, rise in mass manufacture of electronic hardware, growing trend of miniaturization, and the need for mounting mechanical and electrical components. Demand from original as well as contract equipment manufacturers for high quality SMT equipment is also expected to drive market growth. Surface mount technology includes integrated circuits, passive surface mount devices, and diodes & transistors. Passive SMDs are offered in wide-ranging package sizes, however majority of these devices are either capacitors or resistors, and the package sizes of these devices are mostly standardized. Diodes and transistors are generally enclosed within a tiny plastic packaging. Integrated circuits are offered in a variety of packages, which depend on the level of interconnectivity needed. Selection of surface mount equipment depends on factors such as equipment and packaging standards, device complexity, number and type of parts needed for placement, and future requirements for flexibility and volume.

The market stands to benefit from the recent rise in the number of contract manufacturers, robust demand for electronic components and smart devices, and stable investments in R&D and technology innovation. Factors such as manufacture of various electronic components in large volumes and miniaturization of components necessitate the utilization of advanced and highly efficient ‘pick & place’ machines, thus benefitting demand for SMT placement equipment. Despite the opportunities for growth, the market will face challenges such as high cost of surface mount equipment, and unsuitability of the technology for high-voltage and high-power circuitry.

As stated by the new market research report on Surface Mount Technology (SMT) Equipment, Asia-Pacific represents the largest and the fastest growing market exhibiting a CAGR of 6.7% during the analysis period. The growth in the region is led by booming electronics contract manufacturing sector in Southeast Asian countries. In Europe, growth will be supported by the European governments’ focus on the development of the manufacturing sector, especially electronics and hardware production by supporting manufacturing clusters and start-ups in the region.

Major players covered in the report include ASM Assembly Systems GmbH & Co. KG, CyberOptics Corp., Electro Scientific Industries, Inc., Fuji Machine Manufacturing Co., Ltd., Glenbrook Technologies, Inc., Heller Industries, Inc., Hitachi, Ltd., Hitachi High Technologies Corp., Illinois Tool Works, Inc., Juki Corp., Koh Young Technology, Inc., Kulicke & Soffa Pte Ltd., Mycronic AB , Naprotek, Inc., Nikon Metrology NV , Nordson DAGE , Omron Corp., Orbotech, Ltd., Saki Corp., Teradyne, Inc., Universal Instruments Corp., Viscom AG, and YXLON International GmbH, among others.

The research report titled " Surface Mount Technology (SMT) Equipment: A Global Strategic Business Report" announced by Global Industry Analysts, Inc., provides a comprehensive review of market trends, drivers, and strategic industry activities of major companies worldwide. The report provides market estimates and projections in value terms (US$ Thousand) for all major geographic markets including the US, Japan, Europe, Asia-Pacific (China, South Korea, Taiwan, and Rest of Asia Pacific), and Rest of World. The report also analyzes the global and regional markets for Surface Mount Technology (SMT) Equipment by product groups/segments - Screen Print Equipment (Manual, Semiautomatic, and Automatic), Placement Equipment (High-Speed, Medium-Speed, and Low-Speed), Soldering Equipment (Reflow Oven, and Wave Oven), Cleaning Equipment, Inspection Equipment (Optical, X-Ray, and Laser), Repair & Rework Equipment Manual, and Semiautomatic).

 

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