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Semiconductor Capital Equipment

Abstract

This report presents Insights into the Semiconductor Capital Equipment Market. Illustrated with 61 data tables, the report comprises of a brief statistical summarization of the worldwide Outsourced Semiconductor Assembly and Test market size for the years 2012 through 2017. Also included are global competitive player market shares encompassing China, and Japan.

Code: MT-00423
Price: $2495
Report Type: Market Trends & Insights
Pages: 63
Date: July 2016
Market Data Tables: 61

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Semiconductor Capital Equipment......4
Table 1: Semiconductor Capital Equipment Market by Type Worldwide (2015) - Percentage Share Breakdown by Value for Chemical Vapor Deposition, Conductor Etch, Dry Etch (incl. TSV Pump and Mask Etching), Non Tube Reactor Chemical Vapor Deposition, Wafer Fabrication Equipment, and Others......4
Assembly and Packaging Equipment......5
Table 2: Global Assembly Equipment Market (2014) in US$ Million......5
Table 3: Assembly Equipment Market by Segment Worldwide (2014) - Percentage Share Breakdown by Value Sales for Die Attach, Packaging, Plating, Wire Bonding, and Others......5
Table 4: Global Outsourced Semiconductor Assembly and Test Market (OSAT) (2012-2017) in US$ Million......6
Table 5: Flex Circuit Assembly Market by Segment Worldwide (2014) - Percentage Share Breakdown by Value Sales for Automobile, Communications, Computing Business, Consumer, Defence Electronics, Displays, IC packing, Industrial and Medical......7
Table 6: LCD Driver IC Test and Assembly Market by Product Worldwide (2015) - Percentage Share Breakdown by Value for Chip Board, ChipMOS, LB Semicon, Nepes, and Others......8
Chemical Mechanical Planarization (CMP)......9
Table 7: Etch, Clean and Planarization Equipment Market by Country Worldwide (2015) - Percentage Share Breakdown by Value for Japan, and Others......9
Metal-Organic Chemical Vapour Deposition (MOCVD)......10
Table 8: Metal-Organic Chemical Vapour Deposition (MOCVD) Shipments by Category Worldwide (2015) - Percentage Market Share Breakdown by Volume for New Metal-Organic Chemical Vapour Depositions (MOCVDs) and Replacement Metal-Organic Chemical Vapour Depositions (MOCVDs)......10
Table 9: Metal-Organic Chemical Vapour Deposition (MOCVD) Equipment Shipments by Region Worldwide (2014) - Percentage Market Share Breakdown by Value for China, Japan, Korea, Taiwan, and Others......11
Coating Core Physical Vapor Deposition (PVD)......12
Table 10: Coating Core Physical Vapor Deposition (PVD) Market by Segment Worldwide (2015) - Percentage Breakdown by Value for Components and Tools......12
Deposition Equipment......13
Table 11: Deposition Equipment Market by Country Worldwide (2015) - Percentage Share Breakdown by Value for Japan, and Others......13
Etch Equipment......14
Table 12: Global Etch Systems Market by Category Worldwide (2014) - Percentage Share Breakdown by Value Sales for Dielectric Etch Systems, Metal Etch Systems, and Silicon Etch Systems......14
Test Equipment......15
Table 13: Test Equipment Market by Country Worldwide (2015) - Percentage Share Breakdown by Value for Japan, and Others......15
Integrated Circuits (ICs) Packaging and Testing Equipment......16
Table 14: Integrated Circuits (ICs) Packaging and Testing Equipment Production in Taiwan (2015) in NT$ 100 Million......16
Table 15: Integrated Circuit (IC) Fabrication Process Market by Material Type Worldwide (2014) - Percentage Share Breakdown by Value for Gas (CVD & Dry Etch), Photomask, PR & PR Ancil, Silicon Wafers, and Wet Etch & Cleaning......16
Semiconductor Capital Equipment......17
Table 16: Market Shares of Leading Semiconductor Capital Equipment Companies by Value Sales Worldwide (2014) - Percentage Breakdown for Applied Materials, ASM International, ASML, Dainippon Screen, KLA-Tencor, Lam Research, Nikon, Novellus Systems, Teradyne, Tokyo Electron and Others......17
Table 17: Market Shares of Leading Semiconductor Production Equipment (SPM) Manufacturers Worldwide (2014) - Percentage Breakdown by Value for Advantest Corporation, Applied Materials, Inc., ASM International NV, ASML Holding NV, Daifuku Co., Ltd., Dainippon Screen Mfg. Co., Ltd., Disco Corporation, Hitachi High-Technologies Co., Ltd., Hitachi Kokusai Electric, Inc., Kla-Tencor Corporation, Kulicke and Soffa Industries, Inc., Lam Research Corporation, Nikon Metrology NV, NuFlare Technology, Inc., Schmidt Electronics Asia, Ltd., Teradyne, Inc., Tokyo Electron, Ltd., Tokyo Seimitsu Co., Ltd., and Others* (Aixtron SE, BESI, Inc., Canon Anelva Corporation, Canon Anelva Corporation, Canon Semiconductor Equipment Taiwan, Inc., EBARA Technologies, International Business Machines Corporation, Murata Machinery, Ltd., Novellus Systems, Inc., Rudolph Technologies, Inc., Towa Corporation, Ulvac Technologies, Inc., and Veeco Instruments, Inc.)......18
Assembly and Packaging Equipment......19
Table 18: Market Shares of Leading Semiconductor Assembly Equipment Manufacturers Worldwide (2015) - Percentage Share Breakdown by Value for ASM Pacific Technology, Ltd., BE Semiconductor Industries NV, Kulicke and Soffa Industries, Inc., and Others......19
Table 19: Market Shares of Leading Assembly Equipment Manufacturers by Value Sales Worldwide (2014) - Percentage Breakdown for Amkor Technology, Inc., ASE Group, ChipMOS Technologies (Bermuda) Ltd., J-Devices Corporation, Jiangsu Co., Ltd., PowerTech, Siliconware Precision Industries Co., Ltd., STATS ChipPAC Ltd., United Test and Assembly Center Ltd., and Others......20
Chemical Mechanical Planarization (CMP)......21
Table 20: Market Shares of Leading Chemical Mechanical Planarization (CMP) Equipment Manufacturers by Value Sales Worldwide (2014) - Percentage Breakdown for Applied Materials, Inc., Ebara Corporation, Kctech Co., Ltd., and Tokyo Seimitsu Co., Ltd.......21
Chemical Vapor Deposition (CVD)......22
Table 21: Market Shares of Leading Chemical Vapor Deposition (CVD) Manufacturers Worldwide (2015) - Percentage Share Breakdown by Value for Applied Materials, Inc., ASM International N.V., Hitachi Kokusai Electric, Inc., Lam Research Corporation, Tokyo Electron Ltd., Wonik IPS Co., Ltd., and Others......22
Low Pressure Chemical Vapor Deposition (LPCVD)......23
Table 22: Low Pressure Chemical Vapor Deposition (LPCVD) Market by Company by Value Sales Worldwide (2014) - Percentage Breakdown for ASM International N.V., Hitachi Kokusai Electric, Inc., Tokyo Electron Ltd., and Others......23
High Density Plasma Chemical Vapor Deposition (CVD)......24
Table 23: Market Shares of Leading High Density Plasma Chemical Vapor Deposition (CVD) Companies Worldwide (2014) - Percentage Breakdown by Value Sales for Applied Materials, Inc., Lam Research Corporation, and Novellus Systems, Inc.......24
Metal Organic Chemical Vapor Deposition (MOCVD)......25
Table 24: Market Shares of Leading Metal Organic Chemical Vapor Deposition (MOCVD) Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for Aixtron SE, Taiyo Nippon Sanso, and Veeco Instruments, Inc.......25
Table 25: Market Shares of Leading MOCVD Tool Producers by Value Sales Worldwide (2014) - Percentage Breakdown for Aixtron SE, Taiyo Nippon Sanso Corporation, Veeco Instruments Inc. and Others......26
Table 26: Market Shares of Leading Metal-Organic Chemical Vapour Deposition (MOCVD) Equipment Manufacturers in China (2015) - Percentage Market Share Breakdown by Volume for Aucksun Co., Ltd., Elec-Tech International Co., Ltd., Hc Semitek Corporation, San'an Optoelectronics Co., Ltd., Tsinghua Tongfang Co., Ltd., and Others......27
Table 27: Market Shares of Leading MOCVD (Metal-Organic Chemical Vapour Deposition) Manufacturers in Japan (2015) - Percentage Breakdown by Value for AIXTRON SE, and Others......28
Non Tube Reactor Chemical Vapor Deposition (CVD)......29
Table 28: Market Shares of Leading Non Tube Reactor Chemical Vapor Deposition (CVD) Manufacturers Worldwide (2015) - Percentage Share Breakdown by Value for Applied Materials, Inc., ASM International N.V., Lam Research Corporation, Tokyo Electron Ltd., Wonik IPS Co., Ltd., and Others......29
Table 29: Market Shares of Leading Non-Tube Liquid Phase Chemical Vapor Deposition (LPCVD) Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for Applied Materials, Inc., Lam Research Corporation, Novellus Systems, Inc., Tokyo Electron Ltd., and Others......30
Vertical Tube Liquid Phase Chemical Vapor Deposition (LPCVD)......31
Table 30: Market Shares of Leading Vertical Tube Liquid Phase Chemical Vapor Deposition (LPCVD) Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for ASM International NV, Hitachi Kokusai Electric, Inc., and Tokyo Electron, Ltd.......31
Table 31: Market Shares of Leading Vertical Tube Low Pressure Chemical Vapor Deposition (LPCVD) Manufacturers Worldwide (2015) - Percentage Share Breakdown by Value for Hitachi Kokusai Electric, Inc., Tokyo Electron Ltd., and Others......32
Atomic Layer Deposition......33
Table 32: Market Shares of Leading Atomic Layer Deposition Companies Worldwide (2014) - Percentage Breakdown by Value Sales for Aixtron SE, ASM International NV, and Jusung Engineering Co., Ltd.......33
Auto Layer Deposition......34
Table 33: Market Shares of Leading Auto Layer Deposition Manufacturers Worldwide (2015) - Percentage Share Breakdown by Value for ASM International N.V., Jusung Engineering Co., Ltd., Lam Research Corporation, Tokyo Electron Ltd., and Others......34
Deposition Equipment......35
Table 34: Market Shares of Leading Deposition Equipment Manufacturers Worldwide (2015) - Percentage Breakdown by Value for Aixtron SE, Applied Materials, Inc., ASM International N.V, Hitachi, Ltd., Novellus Systems, Inc., Tokyo Electron Ltd., Veeco Instruments, Inc., and Others......35
Electrochemical Deposition......36
Table 35: Market Shares of Leading Electrochemical Deposition (Including Bump) Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for Applied Materials, Inc., Lam Research Corporation, Novellus Systems, Inc., and Tokyo Electron, Ltd.......36
Dry Etch......37
Table 36: Market Shares of Leading Dry Etch Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for Applied Materials, Inc., Hitachi High-Technologies Corporation, Lam Research Corporation, Tokyo Electron, Ltd., and Others......37
Table 37: Market Shares of Leading Dry Etching (incl. TSV Pump & Mask Etching) Equipment Manufacturers Worldwide (2015) - Percentage Share Breakdown by Value for Applied Materials, Inc., Hitachi High Technologies Corporation, Lam Research Corporation, Tokyo Electron Ltd., and Others......38
Dielectric Etch......39
Table 38: Market Shares of Leading Dielectric Etch Systems Manufacturers by Value Sales Worldwide (2014) - Percentage Breakdown for Applied Materials, Inc., Hitachi High-Technologies Corporation, Lam Research Corporation, Mattson Technology, Inc., SEMES Co., Ltd., Tokyo Electron Ltd., and Others......39
Table 39: Market Shares of Leading Dielectric Etching (incl. Bump Etch) Equipment Manufacturers Worldwide (2015) - Percentage Share Breakdown by Value for Lam Research Corporation, Mattson Technology, Inc., Tokyo Electron Ltd., and Others......40
Conductor Etch......41
Table 40: Market Shares of Leading Conductor Etching Equipment Manufacturers Worldwide (2015) - Percentage Share Breakdown by Value for Applied Materials, Inc., Hitachi High Technologies Corporation, Lam Research Corporation, and Others......41
Compound Semiconductor Etch......42
Table 41: Market Shares of Leading Compound Semiconductor Etch Companies Worldwide (2014) - Percentage Breakdown by Value for Lam Research Corporation, ULVAC Technologies, Inc., and Others......42
Metal Etch......43
Table 42: Market Shares of Leading Metal Etch Systems Providers by Value Sales Worldwide (2014) - Percentage Breakdown for Applied Materials, Inc., Hitachi High-Technologies Corporation, and Lam Research Corporation......43
Silicon Etch......44
Table 43: Market Shares of Leading Silicon Etch Systems Manufacturers by Value Sales Worldwide (2014) - Percentage Breakdown for Applied Materials, Inc., Hitachi High-Technologies Corporation, Lam Research Corporation, Mattson Technology, Inc., Tokyo Electron Ltd., and Others......44
Wafer Inspection Equipment......45
Table 44: Market Shares of Leading Wafer Inspection Systems Providers by Value Sales Worldwide (2014) - Percentage Breakdown for Applied Materials, Inc., KLA-Tencor Corporation, and Others......45
Table 45: Market Shares of Leading Wafer Level Packaging Inspection Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for Camtek, Ltd., KLA-Tencor Corporation, Rudolph Technologies, Inc., Topcon Technohouse Corporation, Toray Engineering Co., Ltd., and Others......46
Table 46: Market Shares of Leading Wafer Level Packaging Providers by Value Sales Worldwide (2015) - Percentage Share Breakdown for Applied Materials, Inc., Cisco Systems, Inc., EV Group, Randolph Technology, Inc., ULVAC Technologies, Inc., and Others......47
Table 47: Market Shares of Leading Wafer-Level Packaging Equipment Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for Applied Materials, Inc., DISCO Corporation, EV Group, Rudolph Technologies, Inc., Semes Co., Ltd., SUSS MicroTec Group, The, Tokyo Electron, Ltd., Tokyo Seimitsu Co., Ltd., Ultratech, Inc., Ulvac Technologies, Inc., and Others......48
Table 48: Market Shares of Leading Unpatterned Wafer Inspection Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for Hitachi High-Technologies Corporation, KLA-Tencor Corporation, Lasertec Corporation, and Topcon Technohouse Corporation......49
Table 49: Market Shares of Leading E-Beam Patterned Wafer Inspection Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for Hermes Microvision, Inc., and KLA-Tencor Corporation......50
Table 50: Market Shares of Leading Optical Patterned Wafer Inspection Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for Applied Materials, Inc., KLA-Tencor Corporation, and Toray Engineering Co., Ltd.......51
Table 51: Market Shares of Leading Patterned Wafer Inspection Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for Applied Materials, Inc., Hermes Microvision, Inc., KLA-Tencor Corporation, and Toray Engineering Co., Ltd.......52
Memory Test Equipment......53
Table 52: Market Shares of Leading Memory Tester Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for Advantest Corporation, Teradyne, Inc. and Other Companies......53
Test Equipment......54
Table 53: Market Shares of Leading Test Equipment Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for Advantest Corporation, LTX-Credence Corporation, Teradyne, Inc., and Others......54
System-on-Chip (SOC) Test Equipment......55
Table 54: Market Shares of Leading System-on-Chip (SOC) Test Equipment Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for Advantest Corporation, LTX-Credence Corporation, and Teradyne, Inc.......55
Integrated Circuits (ICs) Packaging and Testing Equipment......56
Table 55: Market Shares of Leading Analog/Linear Integrated Circuit (IC) Test Equipment Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for LTX-Credence Corporation, and Others......56
Table 56: Market Shares of Leading Memory Integrated Circuit (IC) Test Equipment Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for Advantest Corporation, and Teradyne, Inc., and Others......57
Sputter Equipment......58
Table 57: Market Shares of Leading Sputtering (Through-Silicon Via (TSV)) Companies Worldwide (2014) - Percentage Breakdown by Value for Applied Materials, Inc., Canon Anelva Corporation, Lam Research Corporation, Novellus Systems, Inc., OC Oerlikon group, ULVAC Technologies, Inc., and Others......58
Table 58: Market Shares of Leading Sputtering for Bump Processing Companies Worldwide (2014) - Percentage Breakdown by Value for Applied Materials, Inc., OC Oerlikon group, Tokyo Electron, Ltd., ULVAC Technologies, Inc., and Others......59
Rapid Thermal Processing (RTP)......60
Table 59: Market Shares of Leading Rapid Thermal Processing (RTP) Companies Worldwide (2014) - Percentage Breakdown by Value Sales for Applied Materials, Inc., Dainippon Screen Mfg. Co., Ltd., Hitachi High-Technologies Corporation, Mattson Technology, Inc., Ultratech, Inc., and Others......60
Table 60: Market Shares of Leading Oxidation/Diffusion (Rapid Thermal Processing) Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for Applied Materials, Inc., ASM International NV, Dainippon Screen Mfg. Co., Ltd., Excico, Hitachi High-Technologies Corporation, Mattson Technology, Inc., Tokyo Electron, Ltd., and Ultratech, Inc.......61
Table 61: Market Shares of Leading Oxidation/Diffusion Furnace Manufacturers Worldwide (2014) - Percentage Breakdown by Value Sales for ASM International NV, Hitachi High-Technologies Corporation, and Tokyo Electron, Ltd.......62