Welcome : Guest

Flip Chips

Abstract

This report presents Insights into the Flip Chips Market. Illustrated with 12 data tables, the report comprises of a brief statistical summarization of the worldwide market size for the years 2012 through 2017. Also included are global competitive player market shares.

Code: MT-00400
Price: $995
Report Type: Market Trends & Insights
Pages: 16
Date: July 2016
Market Data Tables: 12

 NOTE : Select the checkbox below, and click Add to Cart button to add this report to your shopping cart.
Flip Chips......4
Table 1: Global Flip Chip Market (2012-2017) in US$ Million......4
Table 2: Global Flip Chip Market by Application (2012-2017) in Million Units for Aerospace and Defense, Automotive, Industrial and Medical, Consumer, Computing, and Telecommunications......5
Table 3: Flipchips Market by Category Worldwide (2014) - Percentage Share Breakdown by Value Sales for 14nm and Below, 20/22nm, 28/32nm, 40/45nm, 65nm and 90nm and Above......6
Table 4: Wire Bonders Market by Type Worldwide (2014) - Percentage Breakdown by Value for Flip Chip Bonders and Wire Bonders......7
Flip Chip Packaging......8
Table 5: Flip Chip (FC) Packaging Market by Country Worldwide (2015) - Percentage Share Breakdown by Value for Japan, and Others......8
Table 6: Flip Chip CSP (Chip Scale Packages) Market by Country Worldwide (2015) - Percentage Share Breakdown by Value for Japan, and Others......9
Table 7: Integrated Circuits Market by Category Worldwide (2014) - Percentage Share Breakdown by Volume Sales for Flip Chip and Wafer Level Packaging and Others......10
Table 8: Packaging Equipment Market by Product Worldwide (2015) - Percentage Share Breakdown by Value for Die Bonder, Flip Chip Bonder, Lead Frame, SMT Equipment, Wire Bonder, and Others......11
Table 9: Packaging Tools Market by Segment Worldwide (2015) - Percentage Share Breakdown by Value for Flip Chip, and Wire Bonding......12
Flip Chip Substrates......13
Table 10: Market Shares of Leading Flip Chip CSP (Chip Scale Packages) (including WB-CSP) Substrate Manufacturers by Value Sales Worldwide (2014) - Percentage Breakdown for Ibiden Co., Ltd., Kinsus Interconnect Technology Corporation, Nan Ya Printed Circuit Board Corporation, Semco SA, and Unimicron Technology Corporation......13
Table 11: Market Shares of Leading Flip Chip Substrate Manufacturers by Value Sales Worldwide (2014) - Percentage Breakdown for Ibiden Co., Ltd., Kinsus Interconnect Technology Corporation, Kyocera Corporation, Nan Ya Printed Circuit Board Corporation, NXP Semiconductors NV (NGKSP), Semco SA, Shinko, and Unimicron Technology Corporation......14
Table 12: Market Shares of Leading Flip Chip-BGA (Ball Grid Array) Substrate Manufacturers by Value Sales Worldwide (2014) - Percentage Breakdown for Ibiden Co., Ltd., Kinsus Interconnect Technology Corporation, Kyocera Corporation, Nan Ya Printed Circuit Board Corporation, NXP Semiconductors NV (NGKSP), Semco SA, Shinko, and Unimicron Technology Corporation......15