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IC Substrates

Abstract

This report presents Insights into the IC Substrates Market. Illustrated with 6 data tables, the report comprises of a brief statistical summarization of the worldwide market for the years 2012 through 2017. Also included are global competitive player market shares.

Code: MT-00399
Price: $495
Report Type: Market Trends & Insights
Pages: 10
Date: July 2016
Market Data Tables: 6

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IC Substrates......4
Table 1: Global IC Substrate Market (2012-2017) in US$ Million......4
Table 2: Global IC Substrates Packaging Market by Country (2014) - Percentage Share Breakdown for Taiwan and Others......5
IC Substrates......6
Table 3: Leading IC Substrates Producer’s Worldwide (2014) - Percentage Market Share Breakdown by Value Sales for IBIDEN, SEMCO, Shinko, NANYA PCB, Unimicron, Kinsus and Others......6
Flip Chip Substrates......7
Table 4: Market Shares of Leading Flip Chip CSP (Chip Scale Packages) (including WB-CSP) Substrate Manufacturers by Value Sales Worldwide (2014) - Percentage Breakdown for Ibiden Co., Ltd., Kinsus Interconnect Technology Corporation, Nan Ya Printed Circuit Board Corporation, Semco SA, and Unimicron Technology Corporation......7
Table 5: Market Shares of Leading Flip Chip Substrate Manufacturers by Value Sales Worldwide (2014) - Percentage Breakdown for Ibiden Co., Ltd., Kinsus Interconnect Technology Corporation, Kyocera Corporation, Nan Ya Printed Circuit Board Corporation, NXP Semiconductors NV (NGKSP), Semco SA, Shinko, and Unimicron Technology Corporation......8
Table 6: Market Shares of Leading Flip Chip-BGA (Ball Grid Array) Substrate Manufacturers by Value Sales Worldwide (2014) - Percentage Breakdown for Ibiden Co., Ltd., Kinsus Interconnect Technology Corporation, Kyocera Corporation, Nan Ya Printed Circuit Board Corporation, NXP Semiconductors NV (NGKSP), Semco SA, Shinko, and Unimicron Technology Corporation......9